Resonation device, electronic apparatus, and moving object

ABSTRACT

A quartz crystal oscillator as a resonation device includes a substrate, a quartz crystal resonator as a resonator attached with a heating element, terminals adapted to fix the resonator and the substrate to each other, and intermediate members having an electrical insulation property and lower in thermal conductivity than the terminals. The intermediate members intervene between the resonator and the substrate via the terminals, and a gap is disposed between the quartz crystal resonator and the substrate.

BACKGROUND

1. Technical Field

The present invention relates to a resonation device, and an electronicapparatus and a moving object each equipped with a resonation device.

2. Related Art

Since quartz crystal oscillators vary in frequency with a variation intemperature, there are used constant-temperature quartz crystaloscillators in which the temperature of the quartz crystal resonator ismaintained at a constant level by heating the quartz crystal resonatorusing a heating element such as a heater. In such a constant-temperaturecrystal oscillator, if the quartz crystal resonator is directly mountedon a substrate constituting a part of a thermostatic chamber, the heatof the quartz crystal resonator and the heating element is released tothe substrate. Therefore, it becomes difficult to keep the temperatureof the quartz crystal resonator constant. Further, if it is attempted tokeep the temperature of the quartz crystal resonator constant, a largeramount of power must be supplied to the heating element, and therefore,there is a problem that the power consumption increases.

In order to solve the problem described above, in JP-A-2007-6270(Document 1), there is disclosed a structure in which a gap is disposedbetween the substrate and the quartz crystal resonator inconnecting/fixing the quartz crystal resonator provided with the heatingelement and the substrate to each other with a lead wire.

In such a configuration according to Document 1, the gap is disposedbetween the substrate and the quartz crystal resonator to therebyinhibit the heat of the quartz crystal resonator from being released tothe substrate. However, since the lead wire performs both of theelectrical connection and the mechanical fixation between the quartzcrystal resonator and the substrate, the connection between the quartzcrystal resonator and the substrate is achieved by the plate-like leadwire having mechanical strength and silver solder. Since the lead wireand the silver solder are high in thermal conductivity, the heat isreleased from the quartz crystal resonator to the substrate via the leadwire. Therefore, since the heat is easily released from the quartzcrystal resonator, the power consumption increases, and it is difficultto reduce the power consumption.

SUMMARY

An advantage of some aspects of the invention is to solve at least apart of the problems described above, and the invention can beimplemented as the following aspects and application examples.

APPLICATION EXAMPLE 1

This application example is directed to a resonation device including asubstrate, a resonator, a heating element adapted to heat the resonator,a terminal adapted to connect the resonator and the substrate to eachother, and an intermediate member lower in thermal conductivity than theterminal disposed at least one of between the resonator and theterminal, and between the terminal and the substrate.

The resonation device keeps constant temperature in order to suppressthe frequency variation due to the temperature variation by heating theresonator using the heating element. In the case in which the heat ofthe resonator is easy to be released to the substrate, the power to besupplied to the heating element for keeping the temperature of theresonator constant is increased. Therefore, by disposing theintermediate member lower in thermal conductivity than the terminalbetween the resonator and the substrate, the heat can be inhibited frombeing released from the resonator to the substrate. As a result, thepower supply to the heating element for keeping the temperature of theresonator constant can be reduced, and thus, the frequency stability ofthe resonator can be improved while achieving the reduction of the powerconsumption.

APPLICATION EXAMPLE 2

In the resonation device according to the application example describedabove, it is preferable that the intermediate member is an insulatingmember, and the resonator and the substrate are electrically connectedto each other with the terminal and an electrically-conductiveconnection material lower in thermal conductivity than the terminal.

According to the configuration described above, since the mechanicalfixation between the resonator and the substrate is achieved using theterminal, it is sufficient for the electrically-conductive connectionmaterial to achieve only the electrical connection between the resonatorand the substrate. Therefore, by reducing the cross-sectional area ofthe heat transfer path so as to lower the thermal conductivity of theelectrically-conductive connection material, the heat can be inhibitedfrom being released from the resonator to the substrate.

APPLICATION EXAMPLES 3 AND 4

In the resonation device according to the application example describedabove, it is preferable that the intermediate members are respectivelydisposed between the resonator and the terminal, and between theterminal and the substrate.

According to the configuration described above, the intermediate memberslower in thermal conductivity than the terminal respectively intervenebetween the resonator and the terminal, and between the terminal and thesubstrate. Therefore, the heat can further be inhibited from beingreleased from the resonator to the substrate, and at the same time, theexternal heat can also be inhibited from being transferred to theresonator.

APPLICATION EXAMPLES 5 AND 6

In the resonation device according to the application example describedabove, it is preferable that the intermediate member is lower in thermalconductivity than the resonator in a case in which the intermediatemember is disposed between the resonator and the terminal, and theintermediate member is lower in thermal conductivity than the substratein a case in which the intermediate member is disposed between theterminal and the substrate.

According to the configuration described above, since the thermalconductivity of the intermediate member is lower than the thermalconductivity of the constituent (the substrate or the resonator) havingcontact with the intermediate member, the heat is difficult to betransferred from the resonator to the terminal via the intermediatemember, or the heat is difficult to be transferred from the terminal tothe substrate via the intermediate member compared to the case ofdirectly connecting the terminal to the resonator and the substrate.Therefore, the heat can further be inhibited from being released fromthe resonator to the substrate, and at the same time, the external heatcan also be inhibited from being transferred to the resonator.

APPLICATION EXAMPLES 7 AND 8

In the resonation device according to the application example describedabove, it is preferable that the intermediate members are lower inthermal conductivity than at least one of the substrate and theresonator.

According to the configuration described above, since the thermalconductivity of the intermediate member is lower than the thermalconductivity of at least one of the substrate and the resonator, theheat is difficult to be transferred from the resonator to the terminalvia the intermediate member, or the heat is difficult to be transferredfrom the terminal to the substrate via the intermediate member comparedto the case of directly connecting the terminal to the resonator and thesubstrate. Therefore, the heat can further be inhibited from beingreleased from the resonator to the substrate, and at the same time, theexternal heat can also be inhibited from being transferred to theresonator.

APPLICATION EXAMPLE 9

In the resonation device according to the application example describedabove, it is preferable that the electrically-conductive connectionmaterial is a metal wire.

As the metal wire, there can be adopted, for example, a bonding wire,which is a thin wire with a diameter in a range of about 20 through 50μm. Therefore, since the cross-sectional area is small despite the metalwire, the heat transfer in the electrical connection section can besuppressed.

APPLICATION EXAMPLE 10

In the resonation device according to the application example describedabove, it is preferable that the electrically-conductive connectionmaterial is an electrically-conductive adhesive.

Here, as the electrically-conductive adhesive, there can be cited, forexample, a thermosetting electrically-conductive epoxy adhesive. Byusing such a connection material, the connection area can be limited toa range in which the electrical connection is achievable using adispenser or the like when applying the adhesive, and therefore, theheat transfer in the electrical connection section can be suppressed.

APPLICATION EXAMPLE 11

This application example is directed to an electronic apparatusincluding the resonation device described above.

According to such an electronic apparatus as described above, it ispossible to provide an electronic apparatus, which can keep theresonator at predetermined temperature with low power consumption, andis so accurate that the frequency is difficult to vary in accordancewith the temperature variation.

APPLICATION EXAMPLE 12

This application example is directed to a moving object including theresonation device described above.

In most cases, moving objects are used in an environment with asignificant temperature variation. Therefore, by installing theresonation device described above in the moving object, it is possibleto keep the resonator at predetermined temperature with low powerconsumption. Therefore, it is possible to realize the moving objectprovided with reliability so high that the frequency does not varydespite the variation in external temperature.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a plan view showing an internal structure of a quartz crystaloscillator as a resonation device according to a first embodiment of theinvention.

FIG. 2 is a cross-sectional view showing an A-A cut surface in FIG. 1.

FIG. 3 is a cross-sectional view showing a B-B cut surface in FIG. 1.

FIG. 4 is a partial cross-sectional view showing a connection section ofa terminal according to a second embodiment of the invention.

FIG. 5 is a partial cross-sectional view showing a connection/fixationstructure between a quartz crystal resonator and a substrate accordingto a third embodiment of the invention.

FIGS. 6A and 6B are diagrams showing a connection structure between aterminal and a substrate according to a fourth embodiment of theinvention, wherein FIG. 6A is a partial plan view, and FIG. 6B is apartial cross-sectional view showing an A-A cut surface in FIG. 6A.

FIGS. 7A through 7C are diagrams showing a connection structure betweena terminal and a substrate according to a fifth embodiment of theinvention, wherein FIG. 7A is a partial plan view, FIG. 7B is a partialcross-sectional view showing an A-A cut surface in FIG. 7A, and FIG. 7Cis a partial cross-sectional view showing a modified example of thefifth embodiment.

FIG. 8 is a partial cross-sectional view showing a connection structurebetween a terminal and a substrate according to a sixth embodiment ofthe invention.

FIG. 9 is a partial cross-sectional view showing a quartz crystaloscillator according to a seventh embodiment of the invention.

FIG. 10 is a perspective view showing an example of an appearance of anelectronic apparatus according to an application example.

FIG. 11 is a perspective view showing an example of an appearance of amoving object according to an application example.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Some embodiments of the invention will hereinafter be explained withreference to the accompanying drawings.

It should be noted that the resonation device according to each of theembodiments described hereinafter will be explained showing aconfiguration of a quartz crystal oscillator 1, which uses a quartzcrystal resonator 10 as a resonator, as an example.

Further, the drawings referred to in the following explanation areschematic diagrams having contraction scales in the vertical andhorizontal directions and the thickness of each of the constituents orthe parts different from the actual ones in order for providing theconstituents with recognizable sizes.

Resonation Device First Embodiment

FIG. 1 is a plan view showing an internal structure of the quartzcrystal oscillator 1 as the resonation device according to a firstembodiment, FIG. 2 is a cross-sectional view showing an A-A out surfacein FIG. 1, and FIG. 3 is a cross-sectional view showing a B-B cutsurface in FIG. 1. As shown in FIGS. 1 through 3, the quartz crystaloscillator 1 is provided with a quartz crystal resonator 10 as theresonator housed in a space 50 surrounded by a substrate 30 and a lidmember 40. A heating element 20 is connected to a central portion of aprincipal surface 10 a of the quartz crystal resonator 10 using anelectrically-conductive connection material 83. The quartz crystalresonator 10 and the heating element 20 are separated from the outsidewith the substrate 30 and the lid member 40.

It should be noted that the connection material used for the connectionof the heating element 20 is not limited to the electrically-conductiveconnection material 83, but can be any connection material high inthermal conductivity in order to make the heat of the heating element 20easy to transfer to the quartz crystal resonator 10.

The quartz crystal resonator 10 and the substrate 30 are connected(mechanically connected) to each other with four terminals 61, 62, 63,and 64 (hereinafter collectively referred to as terminals 60) so as tokeep a gap in a thickness direction of the quartz crystal oscillator 1.It is preferable for the gap to be configured to have a distance withwhich the quartz crystal resonator 10 and the substrate 30 are difficultto be affected by the mutual radiation heat.

Although not shown in the drawings, the quartz crystal resonator 10 iscomposed of a quartz crystal resonator element provided with a pair ofexcitation electrodes, and a ceramic package for airtightly housing thequartz crystal resonator element. Connecting electrodes 11 a, 11 b, 11c, and 11 d are disposed respectively on the four corners of theprincipal surface 10 a of the quartz crystal resonator 10. It should benoted that the connecting electrodes 11 a, 11 b, 11 c, and 11 d areexpressed collectively as connecting electrodes 11. The connectingelectrodes 11 are electrically connected to the pair of excitationelectrodes of the quartz crystal resonator element. The substrate 30(the principal surface 30 a) in the space 50 surrounded by the substrate30 and the lid member 40 is provided with an oscillator circuit 91 and aheating element control circuit 92.

The heating element 20 is an element including a power transistor as aheater and a temperature-sensitive element (a thermosensor), whereinelement electrodes 20 a for electrical connection are disposed on a sidesurface of the element, and are connected to the connecting electrodes11 formed on the principal surface 10 a of the quartz crystal resonator10 with a bonding material such as an adhesive having a good thermalconductive property or solder. It should be noted that the powertransistor and the temperature-sensitive element can be formed asrespective chips separated from each other, or a resistance heatingelement can be used instead of the power transistor. Further, theheating element 20 can be connected to the substrate 30 using wirebonding or the like without intervention of the wiring lines formed onthe principal surface of the quartz crystal resonator 10. Further, thetemperature-sensitive element can be provided to the heating elementcontrol circuit 92.

The substrate 30 is a circuit board formed of glass epoxy resin,ceramics, or the like, and electrodes and a wiring pattern not shown areformed on the principal surface 30 a and a reverse surface 30 b.Connecting electrodes 31 a, 31 b, 31 c, and 31 d for achievingelectrical connection to the quartz crystal resonator 10, and elementelectrodes 33, 34 to which the oscillator circuit 91 and the heatingelement control circuit 92 are respectively connected are disposed onthe principal surface 30 a. Further, on the reverse surface 30 b of thesubstrate 30, there are disposed external electrodes 35 for connectingthe quartz crystal oscillator 1 to the equipment on which the quartzcrystal oscillator 1 is mounted.

On the principal surface 30 a of the substrate 30, there is disposed anintermediate member 71, and the intermediate member 71 is locatedbetween the quartz crystal resonator 10 and the connecting electrode 31a in FIG. 1. Similarly, an intermediate member 72 is disposed betweenthe quartz crystal resonator 10 and the connecting electrode 31 b, anintermediate member 73 is disposed between the quartz crystal resonator10 and the connecting electrode 31 c, and an intermediate member 74 isdisposed between the quartz crystal resonator 10 and the connectingelectrode 31 d. Hereinafter, the intermediate members 71, 72, 73, and 74are collectively described as intermediate members 70.

The intermediate members 70 are each a plate member or a rectangularparallelepiped formed of a material lower in thermal conductivity thanmetal and having electrical insulation property such as glass, glassepoxy resin, ceramics such as alumina, or polyimide resin. In thepresent embodiment, these intermediate members 70 are assumed to beformed of a material lower in thermal conductivity than at least theterminals 60. The intermediate members 70 are each connected to apredetermined position on the principal surface 30 a of the substrate 30using an insulating connection material 82. As the insulating connectionmaterial 82, an epoxy adhesive, for example, is used.

It should be noted that as the material of the intermediate members 70,an electrically-conductive material can be selected providing thethermal conductivity is lower than that of the terminals 60.

Further, the intermediate members 70 can be lower in thermalconductivity than the substrate 30.

Further, in the intermediate members 70, the intermediate member 71 andthe intermediate member 72, and the intermediate member 73 and theintermediate member 74 can each be integrated, the intermediate member71 and the intermediate member 74, and the intermediate member 72 andthe intermediate member 73 can each be integrated, and further, aconfiguration of integrating the four intermediate members with eachother can also be adopted.

Further, each of the intermediate members 70 and the insulatingconnection material 82 can be formed of the same member, and formationof the intermediate members 70 and connection of the intermediatemembers 70 to the principal surface 30 a can be performed at the sametime.

The oscillator circuit 91 includes an oscillating circuit section and anamplifying circuit section. The quartz crystal resonator 10, theoscillating circuit section, and the amplifying circuit sectionconstitutes an oscillation circuit. The oscillation circuit of thepresent embodiment is a feedback oscillation circuit in which the quartzcrystal resonator 10 is oscillated by the oscillating circuit section,the oscillation output is amplified by the amplifying circuit section,and the result is partially fed back to the oscillating circuit section,and an output signal with an accurate frequency is output from thequartz crystal oscillator 1. It should be noted that the oscillatorcircuit 91 can include a frequency temperature compensation circuit forcompensating the frequency-temperature characteristic.

The heating element control circuit 92 includes a temperature controlcircuit for controlling the temperature of the quartz crystal resonator10 so as to be increased to and then kept in predetermined temperatureby controlling the supply power to the heating element 20 based on thedetection output of the temperature-sensitive element.

The terminals 60 is each a thin plate-like metal member formed of amaterial such as kovar or 42Alloy. The terminals 60 are each formed tobe bent. The terminal 61 will be explained as a representative examplewith reference to FIG. 2. The terminal 61 is a thin plate-like metalmember having three sections, namely a fixation end section 61 a as aconnection section bent so as to be connected to the quartz crystalresonator 10, a fixation end section 61 b as a connection section bentso as to be connected to the substrate 30, and an intermediateconnection section 61 c connecting the fixation end section 61 a and thefixation end section 61 b to each other, formed integrally.

Then, a connection structure between the quartz crystal resonator 10 andthe heating element 20, and the substrate 30 will be explained. Itshould be noted that although the quartz crystal resonator 10 isconnected to the substrate with the terminals 60, the connectionstructure using the terminals 60 will be explained using the terminal 61as a representative example with reference to FIGS. 1 and 2. Theterminal 61 is fixed to the surface of the connecting electrode 11 aprovided to the quartz crystal resonator 10 in the fixation end section61 a using the electrically-conductive connection material 83. As theelectrically-conductive connection material 83, there is used, forexample, an electrically-conductive epoxy adhesive obtained by mixingmetal particles or metal filler made of silver, copper, aluminum, and soon in epoxy resin, or solder. Therefore, the quartz crystal resonator 10and the terminal 61 are electrically connected to each other.

As shown in FIG. 2, the terminal 61 is connected to the intermediatemember 71 in the fixation end section 61 b using the insulatingconnection material 82. In general, insulating materials are low inthermal conductivity compared to electrical conductor. Therefore, sincethe insulating connection material 82 intervenes between theintermediate member 71 and the principal surface 30 a, and between theintermediate member 71 and the terminal 61, it results that the heattransfer is suppressed between the intermediate member 71 and theprincipal surface 30 a, and between the intermediate member 71 and theterminal 61. As is explained hereinabove, the terminal 61 and thesubstrate 30 are connected to each other with a low thermal conductivitylayer intervening in between, the low thermal conductivity layer havinga three-layer structure having the insulating connection material 82,the intermediate member 71, and the insulating connection material 82stacked on each other from the principal surface 30 a side in thisorder. Therefore, a structure difficult for the heat to be transferredcan be obtained between the quartz crystal resonator 10 and thesubstrate 30.

Further, if a configuration in which the thermal conductivity of theintermediate member 71 is lower than the thermal conductivity of thesubstrate 30 is adopted, since the intermediate member 71 lower inthermal conductivity than the substrate 30 intervenes between thefixation end section 61 b of the terminal 61 and the substrate 30, theheat of the terminal 61 becomes difficult to be transferred to thesubstrate 30 compared to the case in which the fixation end section 61 bof the terminal 61 and the substrate 30 are directly connected to eachother. Therefore, a structure more difficult for the heat to betransferred can be obtained between the quartz crystal resonator 10 andthe substrate 30.

It should be noted that the connection between the fixation end section61 b and the intermediate member 71 can also be performed so that theperiphery of the fixation end section 61 b is surrounded by theinsulating connection material 82 in the state in which the fixation endsection 61 b and the intermediate member 71 have contact with eachother.

As shown in FIGS. 1 and 2, regarding the electrical connection betweenthe quartz crystal resonator 10 and the substrate 30, each of aconnection between the terminal 61 and the connecting electrode 31 a, aconnection between the terminal 62 and the connecting electrode 31 b, aconnection between the terminal 63 and the connecting electrode 31 c,and a connection between the terminal 64 and the connecting electrode 31d is achieved by a metal wire 81. The metal wire 81 is a bonding wire.

As shown in FIGS. 1 and 3, the heating element 20 and the substrate 30are electrically connected to each other via the element electrodes 20 afor the electrical connection of the heating element 20, the quartzcrystal resonator 10, and the terminals 60.

It is known that the resonator such as the quartz crystal resonator 10varies in resonant frequency with the temperature variation. Thefrequency-temperature curve of the quartz crystal resonator 10 isexpressed by a quadratic or cubic curve having temperature at which thefrequency variation takes a minimal value. Therefore, by keeping thetemperature of the quartz crystal resonator 10 in the vicinity of thetemperature at which the frequency variation takes the minimal value,the quartz crystal oscillator 1 small in resonance frequency variationcan be realized. The quartz crystal oscillator 1 according to thepresent embodiment is a device, which keeps the quartz crystal resonator10 at constant temperature by heating the quartz crystal resonator 10 tothe predetermined temperature using the heating element 20 in order tosuppress the resonant frequency variation due to the temperaturevariation.

Such a resonation device as described above is called aconstant-temperature resonation device (a constant-temperature crystaloscillator).

The quartz crystal resonator 10 is heated by the heating element 20 tothereby be kept at constant temperature in order to suppress thefrequency variation due to the temperature variation. In the case inwhich the heat of the quartz crystal resonator 10 is easy to be releasedto the substrate 30, the power to be supplied to the heating element 20for keeping the temperature of the quartz crystal resonator 10 constantis increased. Therefore, by making the intermediate member 70 lower inthermal conductivity than the terminals 60 intervene between the quartzcrystal resonator 10 and the substrate 30, the heat is inhibited frombeing transferred between the quartz crystal resonator 10 and thesubstrate 30. As a result, since the heat can be inhibited from beingreleased from the quartz crystal resonator 10, the temperature of thequartz crystal resonator 10 can be kept constant even if the powersupply to the heating element 20 is reduced, and thus, it is possible toenhance the frequency stability of the resonator, and at the same timeto achieve reduction of the power consumption.

Further, in the present embodiment, the quartz crystal resonator 10 andthe substrate 30 are electrically connected to each other via theterminals 60 and the electrically-conductive connection material. In theelectrical connection configuration, since it is sufficient tomechanically connect the quartz crystal resonator 10 and the substrate30 to each other with the terminals 60 to thereby obtain the rigidity,and further electrically connect the quartz crystal resonator 10 and thesubstrate 30 to each other with the electrically-conductive connectionmaterial, it is possible to suppress the heat transfer from theresonator to the substrate by reducing the cross-sectional area of theheat-transfer path. In the present embodiment, the metal wire 81 is usedas the electrically-conductive connection material. Since the metal wire81 is a thin wire having a diameter in a range of about 20 through 50μm, the cross-sectional area of the heat-transfer path is small, andthus, the heat transfer from the quartz crystal resonator 10 to thesubstrate 30 can be suppressed.

Further, the intermediate members 70 are made to intervene between thesubstrate 30 and the terminals 60. By adopting such a configuration, theheat of the quartz crystal resonator 10 can be inhibited from beingreleased to the substrate 30 via the terminals 60. Further, by providingthe intermediate members 70 near to the substrate 30, the heat from theoutside can be inhibited from being transferred to the quartz crystalresonator 10.

Further, the connection between the substrate 30 and the intermediatemembers 70, and the connection between the terminals 60 and theintermediate members 70 are achieved by the connection material (theinsulating connection material 82) such as an epoxy adhesive lower inthermal conductivity than the terminals 60. By adopting such aconfiguration as described above, the heat transfer can be suppressed inthe connection section between the intermediate members 70 and thesubstrate 30, and the connection section between the terminals 60 andthe intermediate members 70.

It should be noted that in the case in which a sufficientheat-insulating effect is obtained by, for example, thickening theintermediate members 70, it is possible to use a connection materialother than the insulating connection material 82.

It should be noted that in the present embodiment, the quartz crystalresonator 10 is used as the resonator. Although the quartz crystalresonator 10 is superior in frequency-temperature characteristic toresonators other than the quartz crystal resonator, theconstant-temperature type provided with the heating element is adoptedin order to further improve the accuracy. Therefore, by adopting theconfiguration described above, the temperature of the quartz crystalresonator can be kept constant, and thus, the resonation device such asthe quartz crystal oscillator high in accuracy and low in powerconsumption can be realized.

Resonation Device Second Embodiment

Then, a second embodiment of the invention will be explained withreference to FIG. 4. The second embodiment is characterized in that theintermediate members 71, 75 are disposed on both of the substrate 30side and the quartz crystal resonator 10 side. The parts common to thefirst embodiment and the second embodiment are denoted with the samereference numerals as those in the first embodiment, and the partsdifferent from the first embodiment will mainly be explained.

FIG. 4 is a partial cross-sectional view showing a connection section ofthe terminals 60 according to the second embodiment. The terminal 61will be explained as a representative example. It should be noted thatthe fixation structure and the connection structure on the substrate 30side are common to the first embodiment and the second embodiment, andthe explanation thereof will be omitted.

As shown in FIG. 4, on the quartz crystal resonator 10 side, theintermediate member 75 is connected to the principal surface 10 a of thequartz crystal resonator 10 with the insulating connection material 82.The terminal 61 is connected to the intermediate member 75 in thefixation end section 61 a using the insulating connection material 82.As the material of the intermediate member 75 and the insulatingconnection material 82, the same materials used in the first embodimentcan be used.

The quartz crystal resonator 10 and the terminal 61 are electricallyconnected to each other between the connecting electrode 11 a providedto the quartz crystal resonator 10 and the terminal 61 (the fixation end61 a) with the metal wire 81.

As described above, also on the quartz crystal resonator 10 side inaddition to the substrate 30 side, the connection is achieved by makingthe heat-insulating layer intervene, which has the three-layer structurecomposed of the insulating connection material 82, the intermediatemember 75, and the insulating connection material 82 stacked on eachother in this order from the principal surface 10 a side. Therefore, itis possible to make the heat difficult to be transferred between thequartz crystal resonator 10 and the terminals 60, and between theterminals 60 and the substrate 30 to thereby further suppress therelease of the heat from the quartz crystal resonator 10 to thesubstrate 30, and the transfer of the heat from the outside to thequartz crystal resonator 10 via the substrate 30.

It should be noted that it is also possible to adopt a structure inwhich the terminal 61 is directly connected to the quartz crystalresonator 10 using the insulating connection material 82, and thefixation end section 61 a of the terminal 61 and the connectingelectrode 11 a are connected to each other with the metal wire 81. Onthis occasion, as the insulating connection material 82, there is used amaterial having a thermal conductivity equivalent to that of theintermediate member 75, or a material having a thermal conductivitylower than that of the intermediate member 75.

Further, the thermal conductivity of the intermediate member 75 can belower than the thermal conductivity of the quartz crystal resonator 10.By adopting such a configuration, since the intermediate member 75 lowerin thermal conductivity than the quartz crystal resonator 10 intervenesbetween the fixation end section 61 a of the terminal 61 and the quartzcrystal resonator 10, the heat of the quartz crystal resonator 10becomes difficult to be transferred to the terminal 61 compared to thecase of directly connecting the fixation end section 61 a of theterminal 61 and the quartz crystal resonator 10 to each other.Therefore, a structure more difficult for the heat to be transferred canbe obtained between the quartz crystal resonator 10 and the substrate30.

Further, in the case in which the intermediate member 71 exists betweenthe substrate 30 and the fixation end section 61 b, and the intermediatemember 75 exists between the quartz crystal resonator 10 and thefixation end section 61 a as shown in FIG. 4, it is also possible toarrange that the intermediate member 71 and the intermediate member 75have a thermal conductivity lower than the thermal conductivity of atleast one of the substrate 30 and the quartz crystal resonator 10. Byadopting such a configuration as described above, since the intermediatemember 71 lower in thermal conductivity than the substrate 30 intervenesbetween the substrate 30 and the fixation end section 61 b, the heat ofthe terminal 61 becomes difficult to be transferred to the substrate 30compared to the case of directly connecting the substrate 30 and thefixation end section 61 b to each other, or since the intermediatemember 75 lower in thermal conductivity than the quartz crystalresonator 10 intervenes between the quartz crystal resonator 10 and thefixation end section 61 a, the heat of the quartz crystal resonator 10becomes difficult to be transferred to the terminal 61 compared to thecase of directly connecting the quartz crystal resonator 10 and thefixation end section 61 a to each other. Therefore, a structuredifficult for the heat to be transferred can be obtained between thequartz crystal resonator 10 and the substrate 30.

Further, it is also possible to adopt a structure in which theintermediate member 75 is disposed only on the quartz crystal resonator10 side, and the terminal 60 is directly connected to the substrate 30using the insulating connection material 82 on the substrate 30 side.

Resonation Device Third Embodiment

Then, a third embodiment of the invention will be explained withreference to FIG. 5. The third embodiment is characterized in the pointthat such bend of the terminals 60 as in the first embodiment and thesecond embodiment is eliminated by keeping a gap between the quartzcrystal resonator 10 and the substrate 30 using the thickness of theintermediate member 70.

FIG. 5 is a partial cross-sectional view showing a connection/fixationstructure between the quartz crystal resonator 10 and the substrate 30according to the third embodiment. It should be noted that FIG. 5 showsthe position corresponding to the A-A cut surface in FIG. 1. As shown inFIG. 5, the intermediate members 70 are disposed on the principalsurface 30 a of the substrate 30. As a configuration of the intermediatemembers 70, it is possible to adopt the configuration similar to theconfiguration of the first embodiment except the thickness differentfrom that of the intermediate members 70 of the first embodiment. Forexample, the intermediate members 70 can be disposed on the four cornersof the quartz crystal resonator 10, or can be integrated to formarectangular frame shape. However, the thickness of the intermediatemembers 70 is set so that there can be kept the distance comparable withthe gap between the quartz crystal resonator 10 and the substrate 30 inthe description of the first embodiment and the second embodiment.

It is assumed that the material of the intermediate members 70 is thesame as that of the intermediate members 70 in the first embodiment, andis lower in thermal conductivity than the terminal 60. The intermediatemembers 70 are each connected to the principal surface 30 a of thesubstrate 30 with the insulating connection material 82. The terminals60 (the terminals 61, 64 are shown in FIG. 5) are each a metal memberwithout a bend. One ends of the terminals 60 are connected respectivelyto the connecting electrodes 11 (the connecting electrodes 11 a, 11 dare shown in FIG. 5) with the electrically-conductive connectionmaterial 83 on the quartz crystal resonator 10 side, and the other endsare connected respectively to the intermediate members 70 with theinsulating connection material 82. The terminals 61, 64 are connectedrespectively to the connecting electrodes 31 a, 31 d with the metalwires 81. In this structure, the connecting electrodes 11 (theconnecting electrodes 11 a, 11 d are shown in FIG. 5) of the quartzcrystal resonator element extend on the reverse surface 10 b of thequartz crystal resonator 10.

In the structure of the third embodiment, the terminals 60 and thesubstrate 30 are connected to each other with the heat-insulating layerhaving the three-layer structure, which is obtained by stacking theinsulating connection material 82, the intermediate member 70, and theinsulating connection material 82 in this order from the principalsurface 30 a, intervening therebetween while keeping the gap between thequartz crystal resonator 10 and the substrate 30 due to the thickness ofthe intermediate members 70. Therefore, the heat is difficult to betransferred between the quartz crystal resonator 10 and the substrate30.

Further, since the terminals 60 do not have a bend, it becomes easy tomanufacture the terminals 60. Further, in the case of connecting theterminals 60 to the substrate 30 in the state in which the quartzcrystal resonator 10 and the terminals 60 are connected to each other,since the posture of the quartz crystal resonator 10 is stabilized,there is an advantage that the connection operation becomes easy.

The third embodiment described above is not limited to the structureshown in FIG. 5, but can be modified.

For example, although not shown in the drawings, it is also possible toadopt a structure in which the quartz crystal resonator 10 and theterminals 60 are connected to each other with the insulating connectionmaterial 82, and the electrical connection between the terminals 60 andthe quartz crystal resonator 10 is achieved by the metal wires 81.

Further, it is also possible to adopt a configuration in which thearrangement of the constituents is kept as shown in FIG. 5, theterminals 60 are bent so as to connect end portions of the terminals 60to the principal surface 10 a of the quartz crystal resonator 10similarly to the case of the first embodiment.

Resonation Device Fourth Embodiment

Then, a fourth embodiment of the invention will be explained withreference to FIGS. 6A and 6B. The fourth embodiment is characterized inthe point that the quartz crystal resonator 10 and the substrate 30 areelectrically connected to each other with the electrically-conductiveadhesive 83 a. The explanation will be presented showing the terminal 62among the four terminals 60 as an example based on the case of takingthe first embodiment as a base configuration.

FIGS. 6A and 6B are diagrams showing a connection structure between theterminal 62 and the substrate 30 according to the fourth embodiment,wherein FIG. 6A is a partial plan view, and FIG. 6B is a partialcross-sectional view showing an A-A cut surface in FIG. 6A.

As shown in FIGS. 6A and 63, the connection/fixation structure with theterminal 62 on the quartz crystal resonator 10 side is substantially thesame as in the first embodiment, and the fixation end section 62 a ofthe terminal 62 is electrically connected to the connecting electrode 11b of the quartz crystal resonator 10 with the electrically-conductiveconnection material 83. On the other hand, on the substrate 30 side, theintermediate member 72 is connected with the insulating connectionmaterial 82, and further, the fixation end section 62 b of the terminal62 is connected to the intermediate member 72 with the insulatingconnection material 82. It should be noted that the intermediate member72 and the insulating connection material 82 can be formed of the samemember, and formation of the intermediate member 72 and connection ofthe fixation end section 62 b to the principal surface 30 a of thesubstrate 30 can be performed at the same time.

The connecting electrode 31 b provided to the substrate 30 and theterminal 62 are electrically connected to each other with theelectrically-conductive adhesive 83 a. Since the mechanical holding ofthe quartz crystal resonator 10 is achieved by the terminal 62, withinthe range in which the connecting electrode 31 b can electrically beconnected to the terminal 62, the smaller the area of the connectingelectrode 31 b is the better. For example, it is possible to set thecross-sectional area to be comparable with that of the metal wire 81described above.

By using an electrically-conductive epoxy adhesive or the like as theelectrically-conductive adhesive 83 a, applying theelectrically-conductive adhesive 83 a so as to straddle the fixation endsection 62 b and the connecting electrode 31 b using a dispenser or thelike, and solidifying the electrically-conductive adhesive 83 a byheating, the electrical connection between the terminal 62 and thesubstrate 30 can be achieved.

In the configuration of the fourth embodiment, the intermediate member72 is made to intervene between the substrate 30 and the terminal 62,and is connected to each of the substrate 30 and the terminal 62 usingthe insulating connection material 82 similarly to the case of the firstembodiment. Further, the electrical connection between the quartzcrystal resonator 10 and the substrate 30 is achieved by theelectrically-conductive connection material 83 and theelectrically-conductive adhesive 83 a.

Even in the case of using the electrically-conductive adhesive 83 a, bydecreasing the cross-sectional area (e.g., the width of the electrode)of the connecting electrode 31 b within the range in which theelectrical connection to the terminal 62 can be achieved, the heattransfer in the electrical connection section can be suppressed. Inother words, it is possible to inhibit the heat of the quartz crystalresonator 10 from being released to the substrate 30 via the terminal62, and the heat from the outside from being transferred to the quartzcrystal resonator 10 via the terminal 62.

It should be noted that in the fourth embodiment, it is also possible toadopt the structure in which the heat-insulating layer is made tointervene also on the quartz crystal resonator 10 side similarly to thecase of the second embodiment (see FIG. 4), the heat-insulating layerhaving the three-layer structure composed of the insulating connectionmaterial 82, the intermediate member 75, and the insulating connectionmaterial 82 stacked on each other in this order from the principalsurface 10 a.

It should be noted that although in the present embodiment, theelectrical connection between the fixation end section 62 b and theconnecting electrode 31 b is achieved using the electrically-conductiveadhesive 83 a, it is also possible to apply a solder paste instead ofthe electrically-conductive adhesive using a dispenser or the like, andthen heat the solder paste to be fixed.

Resonation Device Fifth Embodiment

Then, a fifth embodiment of the invention will be explained withreference to FIGS. 7A through 7C. The fifth embodiment is characterizedin the point that the intermediate members 70 are each provided with athrough hole for the electrical connection while adopting the structureof the forth embodiment as a base structure. Therefore, the terminal 62among the four terminals 60 will be explained as a representativeexample focusing mainly on the points different from the fourthembodiment.

FIGS. 7A through 7C are diagrams showing a connection structure betweenthe terminal 62 and the substrate 30 according to the fifth embodiment,wherein FIG. 7A is a partial plan view, FIG. 7B is a partialcross-sectional view showing an A-A cut surface in FIG. 7A, and FIG. 70is a partial cross-sectional view showing a modified example of thefifth embodiment.

As shown in FIGS. 7A and 7B, the intermediate member 72 is provided withthe through hole 72 a penetrating in the thickness direction of theintermediate member 72. A tip portion of the fixation end section 62 bof the terminal 62 is disposed to a position slightly projected from theedge of the through hole 72 a (partially blocking the through hole 72a). The insulating connection material 82 disposed on the substrate 30is provided with a hole penetrating so that the connecting electrode 31b can be seen through the through hole 72 a, and the insulatingconnection material 82 provided to the terminal 62 is disposed only onthe connection section of the fixation end section 62 b. On thesubstrate 30 side, the intermediate member 72 is connected with theinsulating connection material 82, and further, the fixation end section62 b of the terminal 62 is connected to the intermediate member 72 withthe insulating connection material 82. The electrically-conductiveconnection material 83 is applied so as to straddle the inside of thethrough hole 72 a and the fixation end section 62 b, and then heated tobe solidified, and thus, the electrical connection between the terminal62 and the connecting electrode 31 b can be achieved.

In the configuration of the fifth embodiment, the intermediate member 72is made to intervene between the substrate 30 and the terminal 62, andthe substrate 30 and the terminal 62 are electrically connected to eachother using the electrically-conductive connection material 83 such asan electrically-conductive adhesive or a solder paste similarly to thecase of the fourth embodiment. In the fifth embodiment, the intermediatemember 72 is provided with the through hole 72 a to thereby prevent theelectrically-conductive connection material 83 from flowing out to theouter peripheral edge of the through hole 72 a, and thus, the connectionarea between the electrically-conductive connection material 83, and theconnecting electrode 31 b and the substrate 30 is limited. According tothis configuration, the heat transfer between the terminals 60 and thesubstrate 30 via the electrically-conductive connection material 83 canbe suppressed.

Modified Example of Fifth Embodiment

Then, a modified example of the fifth embodiment will be explained withreference to FIG. 7C. Similarly to the fifth embodiment, theintermediate member 72 is provided with the through hole 72 apenetrating in the thickness direction of the intermediate member 72.The tip portion 62 d of the fixation end section 62 b of the terminal 62is bent to be inserted into the through hole 72 a. The insulatingconnection material 82 is also provided with a hole penetrating so thatthe connecting electrode 31 b can be seen through the through hole 72 a.The electrically-conductive connection material 83 is applied so as tosufficiently adhere to the tip portion 62 d inside the through hole 72a, and then heated to be solidified, and thus, the electrical connectionbetween the terminal 62 and the connecting electrode 31 b can beachieved.

The application range of the electrically-conductive connection material83 can be limited by applying the electrically-conductive adhesive tothe inside of the through hole 72 a with a dispenser or the like in thecase of using the electrically-conductive adhesive as theelectrically-conductive connection material 83, or by applying a solderpaste to the inside of the through hole 72 a with a dispenser or thelike and then heating to melt and then cooling to solidify the solderpaste in the case of the solder connection.

By providing the tip portion 62 d thus bent to the terminal 62, itbecomes possible to confine the application range of theelectrically-conductive connection material 83 to the inside of thethrough hole 72 a, and thus the connection areas between theelectrically-conductive connection material 83, and the connectingelectrode 31 b and the terminal 62 can be limited to small sizes.According to this configuration, the heat transfer between the terminals60 and the substrate 30 via the electrically-conductive connectionmaterial 83 can be suppressed.

Resonation Device Sixth Embodiment

Then, a sixth embodiment of the invention will be explained withreference to the drawing. The sixth embodiment is characterized in thepoint that the intermediate members 70 and the fixation end sections ofthe terminals 60 are each provided with a through hole for theelectrical connection while adopting the structure of the forthembodiment as a base structure. Therefore, the terminal 62 among thefour terminals 60 will be explained as a representative example focusingmainly on the points different from the fourth embodiment.

FIG. 8 is a partial cross-sectional view showing a connection structurebetween the terminal 62 and the substrate 30 according to the sixthembodiment. The intermediate member 72 is provided with the through hole72 a penetrating in the thickness direction of the intermediate member72, and the fixation end section 62 b of the terminal 62 is alsoprovided with a through hole 62 e penetrating in the thickness directionof the fixation end section 62 b. Since the insulating connectionmaterial 82 disposed on each of the substrate 30 and the terminal 62 isprovided with a through hole penetrating through the insulatingconnection material 82 in addition to the through hole 62 e and thethrough hole 72 a, there is obtained the state in which the connectingelectrode 31 b can be seen from the fixation end section 62 b. On thesubstrate 30 side, the intermediate member 72 is connected with theinsulating connection material 82, and further, the fixation end section62 b of the terminal 62 is connected to the intermediate member 72 withthe insulating connection material 82. The electrically-conductiveconnection material 83 is applied to the inside of the through hole 72a, the inside of the through hole 62 e of the fixation end section 62 b,and the peripheral edge of the through hole 62 e, and then heated to besolidified, and thus, the electrical connection between the terminal 62and the connecting electrode 31 b can be achieved.

By adopting such a configuration, by providing the through hole 72 b tothe intermediate member 72 and providing the through hole 62 e to theterminal 62, the electrically-conductive connection material 83 can beprevented from flowing out to the outer periphery of the through hole 72a. Further, by confining the electrically-conductive connection material83 to the inside of the through hole 72 a, the contact area between theelectrically-conductive connection material 83 and the terminal 62 canbe limited to a small value. According to this configuration, the heattransfer between the terminals 60 and the substrate 30 via theelectrically-conductive connection material 83 can be suppressed.

It should be noted that in the first through sixth embodiments describedabove, the quartz crystal resonator 10 and the substrate 30 areconnected to each other with the terminals 60 and the intermediatemembers 70 low in thermal conductivity intervening therebetween tothereby inhibit the heat from being transferred between the quartzcrystal resonator 10 and the substrate 30, and the quartz crystaloscillator 1 with the simplified structure can be realized applying thetechnical concept. The above will be explained hereinafter as anotherembodiment.

Resonation Device Seventh Embodiment

Then, a seventh embodiment of the invention will be explained withreference to the drawing. The seventh embodiment is characterized in thepoint that a pedestal 76 corresponding to the intermediate members 70 inthe first through sixth embodiments is used as a device for connectingthe quartz crystal resonator 10 to the substrate 30.

FIG. 9 is a partial cross-sectional view showing the quartz crystaloscillator 1 according to the seventh embodiment. It should be notedthat FIG. 9 shows the cross-sectional view corresponding to the sameposition as the position of the A-A cut surface in FIG. 1. As shown inFIG. 9, the quartz crystal resonator 10 is connected to the substrate 30with the insulating connection material 82 in the state of beingconnected to the pedestal 76 with the insulating connection material 82.

The pedestal 76 is provided with a base section 76 a having aquadrangular planar shape roughly the same as that of the quartz crystalresonator 10, four post sections 76 b respectively projected from thefour corners of the base section 76 a toward the substrate 30. Thepedestal 76 is formed of a material lower in thermal conductivity thanmetal and having electrical insulation property such as glass, glassepoxy resin, ceramics such as alumina, or polyimide resin. The thicknessof the post section 76 b is preferably made thinner within a range inwhich the fixation strength can be kept. The pedestal 76 is connected tothe principal surface 30 a of the substrate 30 at the tip portions ofthe post sections 76 b via the insulating connection material 82.

The heating element 20 is connected to a central portion of theprincipal surface 10 a of the quartz crystal resonator 10, and theconnecting electrodes 11 a through 11 d (the connecting electrodes 11 a,11 d are shown in FIG. 9) are disposed at four corners of the principalsurface 10 a similarly to the first embodiment. The distance between thebase section 76 a of the pedestal 76 and the principal surface 30 a ofthe substrate 30 corresponds to the gap between the quartz crystalresonator 10 and the substrate 30 in the first embodiment (see FIG. 2).The principal surface 30 a of the substrate 30 is provided with theconnecting electrodes 31 a through 31 d (the connecting electrodes 31 a,31 d are shown in FIG. 9). Further, the connecting electrode 11 a andthe connecting electrode 31 a, and the connecting electrode 11 d and theconnecting electrode 31 d, are electrically connected to each other withmetal wires 81, respectively. The electrical connection structurebetween the heating element 20 and the substrate 30 and the structure ofthe 11 d member 40 are the same as those of the first embodiment, andtherefore, the explanation thereof will be omitted.

In such a structure, the quartz crystal resonator 10 is connected to thesubstrate 30 via the pedestal 76 as an intermediate member, and theelectrical connection between the quartz crystal resonator 10 and thesubstrate 30 is achieved by the metal wires 81. Therefore, the heat ismade difficult to be transferred between the quartz crystal resonator 10and the substrate 30.

Although in the first through seventh embodiments described hereinabove,the explanation is presented citing the quartz crystal oscillator 1,which uses the quartz crystal resonator 10 as the resonator, as anexample, the invention can be adapted into a resonator using apiezoelectric element other than the quartz crystal, a resonator havinga piezoelectric element formed on the surface of the base member, a MEMS(Micro Electro Mechanical System) resonator using a semiconductorsubstrate, and so on. Further, the invention can also be applied to anelectronic device having a characteristic varying due to the temperaturevariation other than resonators.

Electronic Apparatus

Although in each of the embodiments described above, the explanation ispresented citing the quartz crystal oscillator 1 as an example of theresonation device, it is possible to adapt the invention to otherresonation devices besides the quartz crystal oscillator 1. For example,there can be cited an angular velocity sensor, an acceleration sensor, atilt sensor, and so on using the resonator as a physical quantitydetection element. Most resonation devices use a method of measuring thephysical quantity to be detected using the fact that the resonantfrequency of the resonator incorporated therein varies in accordancewith the level of the physical quantity. As described above, since theresonant frequency of the resonator has a temperature characteristic, bykeeping the resonator at constant temperature using the heating element,a variety of types of electronic apparatuses performing accuratephysical quantity measurement can be provided.

For example, FIG. 10 shows a schematic diagram of an electronicapparatus (a sophisticated mobile terminal 100) equipped with the quartzcrystal oscillator 1 according to the present embodiment. In thesophisticated mobile terminal 100 shown in FIG. 10 incorporates, forexample, an angular velocity sensor (not shown) for detecting theposture of the sophisticated mobile terminal 100, and the quartz crystaloscillator 1 according to the present embodiment can be used as a clocksource for working the control mechanism of the angular velocity sensor.As described above, by using the quartz crystal oscillator 1 accordingto the present embodiment, a highly reliable electronic apparatus havingresistance to an external impact, vibration, and so on can be realized.

It is possible to adopt a variety of electronic apparatuses as theelectronic apparatus 100 equipped with the resonation device accordingto the present embodiment. There can be cited, for example, a personalcomputer (e.g., a mobile type personal computer, a laptop personalcomputer, and a tablet personal computer), a mobile terminal such as acellular phone, a digital still camera, an inkjet ejection device (e.g.,an inkjet printer), a storage area network apparatus such as a router ora switch, a local area network apparatus, a television set, a videocamera, a video cassette recorder, a car navigation system, a pager, apersonal digital assistance (including one having a communicationfunction), an electronic dictionary, an electronic calculator, anelectronic game machine, a gaming controller, a word processor, aworkstation, a picture phone, a security television monitor, anelectronic binoculars, a POS terminal, a medical instrument (e.g., anelectronic thermometer, a blood pressure monitor, a blood glucosemonitor, an electrocardiograph, ultrasonic diagnostic equipment, and anelectronic endoscope), a fish finder, a variety of measuringinstruments, gauges (e.g., gauges for cars, aircrafts, and boats andships), a flight simulator, a head-mount display, a motion tracer, amotion tracker, a motion controller, and a pedestrian dead reckoning(PDR) system.

Moving Object

The resonation device explained hereinabove can be installed in avariety of moving objects. For example, FIG. 11 shows a schematicdiagram of a moving object (a vehicle 200) equipped with the quartzcrystal oscillator 1 according to the present embodiment. For example,in the vehicle 200 shown in FIG. 11 incorporates an angular velocitysensor (not shown) for detecting the posture, and the quartz crystaloscillator 1 according to the present embodiment can be used as a clocksource for working the control mechanism of the angular velocity sensor.As described above, by using the quartz crystal oscillator 1 accordingto the present embodiment, a highly reliable electronic apparatus havingresistance to an external impact, vibration, and so on can be realized.

It is possible to adopt a variety of moving objects as the moving object200 equipped with the quartz crystal oscillator 1 according to thepresent embodiment. For example, a vehicle (including an electricvehicle), an aircraft such a jet plane or a helicopter, a ship, arocket, and an artificial satellite can be cited.

By installing the quartz crystal oscillator 1 described above in such amoving object as described above, the resonator can be kept atpredetermined temperature with low power consumption, and therefore,there can be realized accurate mobile communication equipment andtransmission communication equipment provided with such high reliabilitythat the frequency does not vary despite the variation in externaltemperature.

The entire disclosure of Japanese Patent Application No. 2013-71575,filed Mar. 29, 2013 is expressly incorporated by reference herein.

What is claimed is:
 1. A resonation device comprising: a substrate; aresonator; a heating element adapted to heat the resonator; a terminaladapted to connect the resonator and the substrate to each other; and anintermediate member lower in thermal conductivity than the terminaldisposed at least one of between the resonator and the terminal, andbetween the terminal and the substrate.
 2. The resonation deviceaccording to claim 1, wherein the intermediate member is an insulatingmember, and the resonator and the substrate are electrically connectedto each other with the terminal and an electrically-conductiveconnection material lower in thermal conductivity than the terminal. 3.The resonation device according to claim 1, wherein the intermediatemembers are respectively disposed between the resonator and theterminal, and between the terminal and the substrate.
 4. The resonationdevice according to claim 2, wherein the intermediate members arerespectively disposed between the resonator and the terminal, andbetween the terminal and the substrate.
 5. The resonation deviceaccording to claim 1, wherein the intermediate member is lower inthermal conductivity than the resonator in a case in which theintermediate member is disposed between the resonator and the terminal,and the intermediate member is lower in thermal conductivity than thesubstrate in a case in which the intermediate member is disposed betweenthe terminal and the substrate.
 6. The resonation device according toclaim 2, wherein the intermediate member is lower in thermalconductivity than the resonator in a case in which the intermediatemember is disposed between the resonator and the terminal, and theintermediate member is lower in thermal conductivity than the substratein a case in which the intermediate member is disposed between theterminal and the substrate.
 7. The resonation device according to claim3, wherein the intermediate members are lower in thermal conductivitythan at least one of the substrate and the resonator.
 8. The resonationdevice according to claim 4, wherein the intermediate members are lowerin thermal conductivity than at least one of the substrate and theresonator.
 9. The resonation device according to claim 2, wherein theelectrically-conductive connection material is a metal wire.
 10. Theresonation device according to claim 2, wherein theelectrically-conductive connection material is anelectrically-conductive adhesive.
 11. An electronic apparatuscomprising: the resonation device according to claim
 1. 12. A movingobject comprising: the resonation device according to claim 1.